We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.

Materials for BGAs, CSPs and other advanced packages under development

Products with superior properties of high resolution, strong adhesion, low moisture water absorption and environmental safety

We offer high performance polymer for flat panel display and semiconductor photoresist applications with our unique technology.

UV tape for dicing process in semiconductor and related field. It is UV curing type which can perfectly hold silicon wafer, resin substrate and other kinds of adherend.

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Specialized molding compounds such as epoxy, diallyl phthalate or other type (except for phenolic)

SUMIMAC^® ECR/ECH has excellent workability and safety and is widely used for electrical insulation of ignition coils, relays, sensors and capacitor applications.

SUMILITERESIN^® ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.

We offer various heat dissipative materials such as Phenolic molding compounds, Epoxy molding compounds and Epoxy liquid resin.

Excellent molded parts molding dies with high precision made of thermoset plastic molding compounds molded parts.

PC plate has outstanding impact resistance and heat resistance at both high and low temperature.

FINELITE MR is designed for optical application, such as cover layer of liquid crystal display where defect-free appearance is required.

Sealed on carrier tape for semiconductors and electrical components packing for SMT process.

Polymer with unique features of aliphatic cyclic main chain.

New type of transparent light-curable polymer.

Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

Halogen-free and environment friendly core materials that has excellentｔ features such as low CTE, low thermal expansion, high TG, and high heat resistance.

Halogen-free and environment friendly prepreg that has excellentｔ features such as low CTE, low thermal expansion, high TG,and high heat resistance.

Halogen-free and environment friendly surface insulation material that has excellentｔ features such as low CTE, low thermal expansion, high TG,and high heat resistance.

Customized Polymer waveguide depending on the customer requirements.

Raw material of carrier tape which is used as semiconductor reel-packaging.

Reel-form packing for semiconductors and electrical components packing for SMT process.

Environmental friendly flame retardant polycarbonate sheet for electrical insulation use.

PC Eco-Sheet V series are environmental friendly polycarbonate sheets for electrical insulation purpose, with halogen-free and phosphorus-free ingredients.

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Specialized molding compounds such as epoxy, diallyl phthalate or other type (except for phenolic)

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

Materials for BGAs, CSPs and other advanced packages under development

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.