Non-thermal curing Photopolymerizable new COP (Low Temperature Processable)

Two crosslinkable functional groups bind together solely using light energy without the generation of gas or other substances.

˙ Photocuring
˙ High Heat Resistance
˙ Low Dielectricity
˙ Low Water Absorption

One of the distinctive characteristics of this COP is its ability to cure without generating gas solely through light exposure. It also possesses excellent thermal stability due to its rigid ring structure, commonly referred to as high Tg, as well as a high thermal decomposition temperature. Additionally, it exhibits low water absorption and high light transmittance, among other various features.

As a result, it becomes a highly clean, light-curable polymer that eliminates the need for thermal, acid, base, or radical initiators.Furthermore, it exhibits low dielectric tangent and low dielectric properties, along with low water absorption and high heat resistance. This enables compatibility with low-temperature curing processes on organic films such as PET films, which was challenging with conventional processes that require high temperatures. It is also capable of patterning and can be developed using solvents such as PGMEA.

Example of characteristics (Film formation, after UV irradiation)
Item	Example of characteristic value
Refractive index	1.54
TGA Td10	420°C @N2
Volumetric resistivity	>10¹⁶ Ω・cm
Water absorption rate	<0.1%
Permittivity ε	2.66 @1kHz
Permittivity ε	2.60 @1MHz
Dielectric loss tangent tanδ	0.0047 @1kHz
Dielectric loss tangent tanδ	0.0052 @1MHz

Remark

The data given above are not guaranteed values.

Resin (heat/acid/base/radical-free) capable of forming crosslinked structure only by introducing photocrosslinkable group β
Patterning If necessary, solvent development
It is possible to control the performance by various types of copolymerization and ratios.