One of the distinctive characteristics of this COP is its ability to cure without generating gas solely through light exposure. It also possesses excellent thermal stability due to its rigid ring structure, commonly referred to as high Tg, as well as a high thermal decomposition temperature. Additionally, it exhibits low water absorption and high light transmittance, among other various features.

As a result, it becomes a highly clean, light-curable polymer that eliminates the need for thermal, acid, base, or radical initiators.Furthermore, it exhibits low dielectric tangent and low dielectric properties, along with low water absorption and high heat resistance. This enables compatibility with low-temperature curing processes on organic films such as PET films, which was challenging with conventional processes that require high temperatures. It is also capable of patterning and can be developed using solvents such as PGMEA.