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In the domestic market of die attach pastes, Sumitomo Bakelite Co., Ltd. has kept the leading position with the highest market share while also actively developing overseas markets. Plants
Laboratory
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The CRM series are one-component type of die attach pastes with high reliability for all semiconductor packages and LED packages.
Bonding of IC chips with lead frames and organic substrates, stacking of IC chips.
Bonding of LED chips with lead frames and organic substrates.
Grade | Features | Main Applications |
---|---|---|
CRM-1030 series | Standard oven cure | SOT, DIP, SO, PLCC, QFP |
CRM-1060 series | Standard in-line cure (Rapid cure) | SOT, DIP, SO, PLCC, QFP |
CRM-1070 series | Low stress | DIP, SO, PLCC, QFP, L/TQFP, TSOP, LF CSP |
CRM-1080 series | High adhesion High electrical conductivity |
Little Chip (SOT, LED etc.) |
CRM-1100 series | Insulation | SOT, DIP, SO, PLCC, QFP, L/TQFP, TSOP, LF CSP |
CRM-1200 series | High thermal conductive adhesive Thermal interface material (TIM) |
DIP, SO, PLCC, QFP, L/TQFP, TSOP |
CRM-1500 series | For laminate PKG | PBGA, FPBGA, FCBGA |
CRM-1700 series | Radical cure type Low stress |
DIP, SO, PLCC, QFP, L/TQFP, TSOP, LF CSP |
CRM-1800 seeries | Super high thermal conductivity Ag sintering |
Discrete, SO, QFP, L/TQFP, LF CSP |
Lead frame package |
Area alley package |