Carrier Tape Materials Cover Tapes (SUMILITE® CSL-Z)

Products

Carrier tape base materials for semiconductors and electrical components packing for SMT process.

Plants

Amagasaki Plant

Laboratory

Technical Development Department, Carrier Tape Business Division

Features

Tearing-free at high speed mounting process

No tearing at high-speed mounter by high endurance material. (If used under proper sealing/peeling condition)

Wide sealing operation range

Required peeling strength can be obtained since our cover tape is not dependent much on sealing temp and pressure.

Superior sealing stability

Small aged deterioration of peel strength after sealing. High stronger reliability at high temp and humidity

Trouble shooting in surface mount process

We, Sumitomo Bakelite Co., Ltd. can provide total solution to prevent from devices sticking to cover tape film surface or devices jumping/migration from carrier tape pocket.

Please feel free to contact us without hesitation.

Applications

Electrical and Electronic Equipment

Electrical Components Packing

Cover Tape for Semiconductors and Electronic Components Devices

Reel-form packing for Semiconductors such as QFP, SOT and CSP, Electronic Components such as LED, Capacitor, Resistor, Connector, and Crystal Oscillator.

Specifications

Item		Unit	Method	Type
Item		Unit	Method	CSL-Z7302 Standard	CSL-Z7500 Excellent Triboelectric Charge Performance
Tensile Strength		MPa	JIS K6734	92	92
Luminous Transmittance		%	JIS K7105	87	87
Haze		%	JIS K7105	25	22
Surface Resistivity	PET	Ω	IEC61340 ANSI ESD STM11.13 23°C×50%RH	10 ^10_11	10 ^10_11
	SEAL		IEC61340 ANSI ESD STM11.13 23°C×50%RH	10 ^8_9	10 ^7_8
	PET		IEC61340 ANSI ESD STM11.13 23°C×30%RH	10 ^10_11	10 ^10_11
	SEAL		IEC61340 ANSI ESD STM11.13 23°C×30%RH	10 ^8_9	10 ^7_8
	PET		IEC61340 ANSI ESD STM11.13 23°C×12%RH	10 ^11_12	10 ^11_12
	SEAL		IEC61340 ANSI ESD STM11.13 23°C×12%RH	10 ^8_9	10 ^7_8
Electrification voltage at Peeled Off		V	SB *1 23°C×50%RH	15	10
Electrification voltage at Peeled Off		V	SB *1 23°C×30%RH	140	65
Triboelectric Charge		nC	SB *2 23°C×30%RH	0.25	0.02

Remark

The data given above are not guaranteed values.
SB Method
*1) Electrification voltage which is measured when cover tape is peeled off at a speed of 0.1sec/tact.
*2) Triboelectric Charge which is measured when resin for molding is vibrated on cover tape at 600 rpm for 5 minutes
*3) Enhanced Surface Resistance on both side under Dry Condition