We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)

Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)

SUMILITERESIN^® ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.

Molded parts and molding dies for automotive parts.

Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

Phenolic resins for friction materials with superior heat resistance and good adhesive performance.

Phenolic resins for shell molding with high mechanical strength and fast curing performance.

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Long fibre reinforced thermoset molding composite fills a niche in specialities

Molded parts and molding dies for automotive parts.

Phenolic resins for rubber-based adhesives (solvent base, latex) to improve mechanical strength and add tackiness.

PC plate has outstanding impact resistance and heat resistance at both high and low temperature.

ABS is a product that provides well balanced properties such as forming, shock resistance and heat resistance.

KD has many superior properties such as moldability, chemical resistance, and flame retardancy, in addition to excellent impact resistance close to polycarbonate materials.

Aluminium based decorative laminates specially developed for interior decoration of railway vehicle and bus.

Customized Polymer waveguide depending on the customer requirements.