Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices SUMICON（R）EME

Products

Sumitomo Bakelite Co., Ltd. is serving the IC encapsulating material market as the top supplier in the world. Since 1971, with our continuous efforts towards technological innovations, we have played the leading role in the industry. Our integrated manufacturing system composed of 4 plants in 4 countries and regions (i.e. Kyushu, Singapore, China, Taiwan) facilitates smoother delivery of our products to clients throughout the world. We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.

Plants

Kyushu Sumitomo Bakelite Co., Ltd.
Sumitomo Bakelite Singapore Pte. Ltd.
Sumitomo Bakelite (Suzhou) Co., Ltd.
Sumitomo Bakelite (Taiwan) Co., Ltd.

Laboratory

Information & Telecommunication materials research Laboratory (Japan)
Information & Telecommunication materials research Laboratory (Taiwan)
Information & Telecommunication materials research Laboratory (China)
Information & Telecommunication materials research Laboratory (Singapore)

Video Contents

Transfer molding

Compression molding

Laser direct structuring on molded surface

Video contents of IT Materials

Features

Environmental friendly

Some SUMIKON EME^® series do not use any bromine and antimony flame retardant, and meet UL-94 V-0.

Comparison with conventional products

Applications

Electrical and Electronic Equipment

Semiconductor Encapsulation

Encapsulation material of protection, moisture resistance and insulation for semiconductor devices

Automotive/Railways/Aircraft

Electronic Components

Encapsulation material of protection, moisture resistance and insulation for Electronic modules (ECU), Sensor modules, Power modules

Motors

Motor rotor magnet fixing

Specifications

Line up	Advantages	Main Applications
EME-E500 series	Halogen free/For small pin count device	DIS, DIP, SO
EME-E590 series	Halogen free/High thermal	TO-220F
EME-E630 series	Halogen free/Low stress	DIP, SO, PLCC, QFP
EME-E670 series	Halogen free/Super low stress	DIP, SO, Power Module
EME-G500 series	Halogen free/For small pin count device	DIP, SO, PLCC, QFP
EME-G600 series	Halogen free/Standard	DIP, SO, PLCC, QFP
EME-G620 series	Halogen free/High reliability	DIP, SO, PLCC, QFP
EME-G630 series	Halogen free/Standard	DIP, SO, PLCC, QFP
EME-G700 series	Halogen free/High reliability	DIP, SO, PLCC, QFP
EME-G750 series	Halogen free/For laminate package Little warpage	BGA/CSP
EME-G760 series	Halogen free/For laminate package Standard grade, High flowability	BGA/CSP
EME-G770 series	Halogen free/For laminate package Improved reliability	BGA/CSP
EME-G790 series	Halogen free/Next generation for laminate package Little warpage, High flowability	BGA/CSP
EME-M100 series	Halogen free/Good Formability/High reliability	For Electric Part Mounting Circuit Board
EME-M630 series	Halogen free/Little warpage/High reliability	For Electric Vehicle Motor (IPM) Magnet Fixing