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Video contents of IT Materials

solution — SOLUTION

Heat Resistance

Heat Dissipation

Epoxy Resins Copper-clad Laminates SUMILITE^® ELC

Heat Insulation

Heat Insulation

Flame Retardancy/
Uninflammability

Cold Resistance

Strength

Impact Resistance

Dimension Stability

Sliming/Light Weight

Electrical Insulation

Antistatic Property

Carrier tape materials (SUMILITE^® CEL/FSL)

High Adhesiveness

機能から探す/高透明性・高光学特性

High Transparency/
High Optical Property

Chemical Resistance

Gas Barrier Property

Eco-friendliness

Compliant with aircraft interior standards

Topics More

2025/01/27 Newsletter [S-BIO Insight] In vitro hair follicle growth model for drug testing
2024/12/26 Products Development of SUMIKON® AM-3800 - a Diallyl Phthalate (DAP) molding compound for high voltage (800V) and high heat resistance
2024/12/25 Newsletter [S-BIO Insight] New Discoveries in Human Milk Glycan Analysis
2024/11/29 Newsletter [S-BIO Insight] Discovering New Mechanisms in Plant-Fungus Interactions using PROTEOSAVE™
2024/10/28 Products Completion Ceremony for New plant of Sumitomo Bakelite (Suzhou) Co., Ltd. for Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices

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