Products
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Information of Substrate Materials for Semiconductor Packages Factory
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Features
Higher reliability, better warpage control and thinner thickness. Material performance required for recent substrates and PCBs can be achieved by LαZ® which has excellent material property such as low CTE, high TG and high modulus.
Applications
Electronic Circuit
Package substrate, etc.
For applications that require higher reliability, better warpage control and thinner thickness boards for package substrates.
Specifications
| Item | Unit | Grade | |
|---|---|---|---|
| LAZ-7751/7752 | |||
| CTE1 | ppm/°C | 15 | |
| Tg [by DMA] | °C | 260 | |
| Tensile Modulus |
@30°C | GPa | 15 |
| @250°C | GPa | 3 | |
| Dielectric Constant (1GHz) | - | 3.4 | |
| Dissipation Factor (1GHz) | - | 0.006 | |
| Peel Strength (Cu12um VLP) | kN/m | 0.7 | |
| Water Absorption (PCT-2hrs/12°C) | wt% | 0.3 | |
Topics More
- 2024/10/28 Products Completion Ceremony for New plant of Sumitomo Bakelite (Suzhou) Co., Ltd. for Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
- 2024/08/01 Products Sumitomo Bakelite Co., Ltd. starts sample shipment of high thermal conductive silver sintering paste for next-generation power semiconductors
- 2024/03/13 Products Completion ceremony of the new plant for Encapsulation of Semiconductor Devices at Sumitomo Bakelite (Taiwan) Co., Ltd.
Substrate Materials for Semiconductor Packages
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