Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
SUMIKON® EME
Product information on epoxy resin molding compounds for encapsulation of semiconductor devices.
Coating Resins for Semiconductor Wafers
Pastes for Die Bonding
Substrate Materials for Semiconductor Packages
Core Material
Halogen free and environment friendly core material with excellent material properties such as low CTE, high TG and high modulus.
Prepreg Material
Halogen free and environment friendly prepreg material with excellent material properties such as low CTE, high TG and high modulus.
Buildup Material
Halogen free and environment friendly build-up material with excellent material properties such as low CTE, high TG and high modulus.
High performance S/R Material
Halogen free and environment friendly S/R Material with excellent material properties such as low CTE, high TG and high modulus.
Topics More
- 2024/10/28 Products Completion Ceremony for New plant of Sumitomo Bakelite (Suzhou) Co., Ltd. for Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
- 2024/08/01 Products Sumitomo Bakelite Co., Ltd. starts sample shipment of high thermal conductive silver sintering paste for next-generation power semiconductors
- 2024/03/13 Products Completion ceremony of the new plant for Encapsulation of Semiconductor Devices at Sumitomo Bakelite (Taiwan) Co., Ltd.
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