产品介绍
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以下为半导体封装基板用材料的产品信息。 生产工厂
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特点
具有热膨胀系数低、尺寸变化小、高Tg、高耐热等优良特性，不含卤素的环保型芯材。
用途
电子、电器领域
主要用于半导体封装基板、模块基板等要求具备高可靠性、纤薄等特点的产品
规格参数
| Item | Unit | Grade | |||||||
|---|---|---|---|---|---|---|---|---|---|
| LAZ-4785TH-M | LAZ-4785TH-JB | LAZ-4785GH-J | LAZ-4785TH-G | LAZ-4785GH-G | ELC-4785TH-B | LAZ-4785GS-BA | |||
| Glass Cloth Type | - | Low CTE | Low CTE | Normal | Low CTE | Normal | Low CTE | Normal | |
| CTE1 xy | ppm/°C | 1.6 | 2 | 5 | 4 | 7 | 6 | 10 | |
| CTE1 z | ppm/°C | 12 | 12 | 12 | 12 | 12 | 12 | 16 | |
| Tg [by DMA] | ppm/°C | 210 | 280 | 280 | 255 | 255 | 265 | 265 | |
| Tensile Modulus |
@30°C | GPa | 35 | 34 | 32 | 32 | 31 | 32 | 29 |
| @250°C | GPa | 18 | 26 | 21 | 21 | 20 | 21 | 18 | |
| Dielectric Constant (1GHz) | - | 4.1 | 4.3 | 4.3 | 4.0 | 4.2 | 4.0 | 4.2 | |
| Dissipation Factor (1GHz) | - | 0.008 | 0.007 | 0.007 | 0.005 | 0.005 | 0.006 | 0.007 | |
| Peel Strength (Cu12um VLP) | kN/m | 0.9 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.8 | |
| Water Absorption (PCT-2hrs/121°C) |
wt% | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | |
专题（英文） 浏览全部
- 2024/10/28 产品信息 Completion Ceremony for New plant of Sumitomo Bakelite (Suzhou) Co., Ltd. for Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices
- 2024/08/01 产品信息 Sumitomo Bakelite Co., Ltd. starts sample shipment of high thermal conductive silver sintering paste for next-generation power semiconductors
- 2024/03/13 产品信息 Completion ceremony of the new plant for Encapsulation of Semiconductor Devices at Sumitomo Bakelite (Taiwan) Co., Ltd.
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