2024
Publicized Technologies

  • The Latest material technology to support power module packaging
    CIPS 2024(March 12-14, 2024)

  • Polymer waveguides and their applications to optical communications
    IEC TC86 JWG9 (March 12, 2024)

  • 100 Gbps PAM4 VCSEL-based Transmission over Meter-scale Flexible Multimode Polymer Waveguides for Board-level Optical Interconnect Applications
    OFC2024 (March, 2024)

  • Material Innovation Redefining Power Module Packaging
    17th European Advanced Technology Workshop on Micropackaging and Thermal management (January 31, 2024)

  • Geometry-based cross-linking algorithm for modeling resorcinol resins through united-atom molecular dynamics simulations
    Polymer vol.293, 126677 (2024).

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