- TOP OPTELECTRONICS SOLOTION S PROVIDER 2023
Semiconductor Review (December, 2023)
- The latest material technology for power module packaging
"From Nano to Micro Power Electronics And Packaging Workshop November 30th 2023" (November 30, 2023）
- Temperature dependence of coupling loss from SMF to polymer optical waveguides with various refractive index profiles
12th IEEE CPMT Symposium Japan (ICSJ2023)(November 17, 2023）
- Probing sensorimotor expertise in professional driving with an immersive racing simulator
Neuroscience 2023(November 11-15, 2023）
- Finite system size correction in microrheological analysis under periodic boundary conditions: a direct numerical simulation
Advanced core-to-core network for the physics of self-organizing active matter(September 12, 2023）
- Finite system size correction in microrheological analysis under periodic boundary conditions: a direct numerical simulation approach
The 7th International Soft Matter Conference (ISMC2023)(September 7, 2023）
- Direct numerical simulations of a microswimmer in a viscoelastic fluid
Soft Matter, 19(37), 7109-7121 (2023)(August 28，2023)
- Development and analysis of a nano‑triangular wave‑shaped polarizer
Scientific Reports (2023) 13:13387(August 17，2023)
- Finite system size correction in microrheological analysis under periodic boundary conditions : a direct numerical simulation approach
The 19th International Congress on Rheology (ICR2023)(August 2，2023)
- The Latest material technology to support power module packaging
Semicon West 2023(July 12，2023)
- Positive Type Photosensitive Wafer Coating
Semicon China 2023(June 29-July 1, 2023)
- Reliability Study for Phtosensitive RDL Material
ICPST-40(June 28-30, 2023)
- FINITE SYSTEM SIZE CORRECTION IN MICRORHEOLOGICAL ANALYSIS UNDER PERIODIC BOUNDARY CONDITIONS : A DIRECT NUMERICAL SIMULATION APPROACH
8th Pacific Rim Conference on Rheology (May 17, 2023)
- Degradation suppression effect of amorphous-hard-carbon-bundled Si-based negative electrode
Materials Advances (March 14, 2023）
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