MobilityMiniaturization and Light Weight
Achieved process reduction and structural freedom through phenolic resin molding,
contributing to the miniaturization and weight reduction of metal substitute parts.
Achieved process reduction and structural freedom through phenolic resin molding,
contributing to the miniaturization and weight reduction of metal substitute parts.
Two materials (Patent pending)
Item | Unit | PM-5945 Isotropic | PM-5940 High strength |
---|---|---|---|
Flexural Strength | MPa | 180 | 200 |
Average CTE | ppm | 23 | 20 |
Isotropic | ー | 1.2 | 2.1 |
Peel Strength | N/cm | 6.3 | 5.4 |
Cross section
Peel strength
Material:specialized for plating
Method:KEC/GHz KEC
Frequency: | 100kHz~1GHz(KEC.) 1GHz~6GHz(GHz KEC.) |
Test method: | JISK6271,JISH8504 |
Material : | PM-5930 |
Aging Temp.: | 220degC |
Plating : | Electroless Ni/Electrolytic Cu & Ni (double side) |
Thickness: | 35um(double side total) |