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MobilityMiniaturization and Light Weight

Achieved process reduction and structural freedom through phenolic resin molding,
contributing to the miniaturization and weight reduction of metal substitute parts.

Plating Thermoset Composite Integration Technology (PM-Plamec series)
(Under Development)

Reliable Thermoset-resin for Plating contributes to the Conversion of Electrification/Electronic Components to Resin.

Advantage

  • High reliability for resin plating
  • Possible to provide characteristics such as electromagnetic wave shielding properties and gas barrier properties

Two materials (Patent pending)

Item Unit PM-5945 Isotropic PM-5940
High strength
Flexural Strength MPa 180 200
Average CTE ppm 23 20
Isotropic 1.2 2.1
Peel Strength N/cm 6.3 5.4

Cross section

Peel strength


Electromagnetic shielding

Material:specialized for plating
Method:KEC/GHz KEC

Frequency: 100kHz~1GHz(KEC.)
1GHz~6GHz(GHz KEC.)
Long term reliability/Heat ageing test
By the plating that the oxidation is prohibited.
Test method: JISK6271,JISH8504
Material : PM-5930
Aging Temp.: 220degC
Plating : Electroless Ni/Electrolytic Cu & Ni (double side)
Thickness: 35um(double side total)

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