MobilityMiniaturization and Light Weight
Achieved process reduction and structural freedom through phenolic resin molding,
contributing to the miniaturization and weight reduction of metal substitute parts.
Achieved process reduction and structural freedom through phenolic resin molding,
contributing to the miniaturization and weight reduction of metal substitute parts.
Provides excellent airtightness after the thermal cycle
Metal:Aluminum A5052(Etching:Laser/Chemical)
Method:JIS Z 2331
Condition:TC(-40℃↔︎150℃、Each 30min)~2000cyc
Condition | Medium | Pressure | Result | |
---|---|---|---|---|
Laser | Chemical | |||
Initial | Air | 1MPa | No Leakage | No Leakage |
Oil | 7MPa | No Leakage | No Leakage | |
After TC ~2000 cyc | Air | 1MPa | No Leakage | No Leakage |
Oil | 7MPa | No Leakage | No Leakage |
※Measuring limit : 1MPa/Air 7MPa/Oil
Povides excellent adhesion to metal after 150℃ heat aging test
Metal:Aluminum A5052(Laser)
Method:ISO Z 19095
Reliability Test:Heat Aging Test(150℃、〜2000h)