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MobilityElectrification

High heat resistance and high insulation thermosetting resin
improves functionality and reliability of electric power train.

Special Molding Compound
for power control module

Adopting to Power Control Module contributes to Further Miniaturization and Lightweight

Advantage

Excellent properties (insulation, heat dissipation, heat resistance, and adhesiveness) contribute to miniaturization and high performance.
High Heat Resistance

Development of SiC / GaN compatible material


Property Unit G720 G780 New
Grade-1
New
Grade-2
Status In Mass Production In Mass Production Sample Sample
Resin system Epoxy New Epoxy1 New Epoxy2 Non-Epoxy
Tg 195 195 240 260
Weight loss
※250℃/1000hr
>2 <2 <2 <2
Adhesion (Ni) 1.0 1.6 1.3 1.0
Dielectric breakdown kV/mm 21 22 22 23
High Heat Dissipation

Develop high thermal concuctive mold compound for several packages.

High Reliability

Development of HTRB compatible material

Photo

Test PKG:TO-247

I-V curve after HTRB test

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High Insulation Resistance

Creeping distance becomes shorter by high CTI

graph

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