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MobilityAD/ADAS

In the connected and AD/ADAS fields, it supports the enhancement of
sensing functions and high-speed communication from the material aspect.

Innovative Interposer Material for Semiconductor Package “LαZ®

Low CTE, High Modulus and high reliability substrate material can be provided witht high and stable quality , which can support to realize thinner and higher density advanced IC package.

Advantage

  • High Modulusus & Stiffness
  • High Heat Resistance
  • High Tg
  • Halogen Free
  • Low Ionic Impurity
  • High Reflectance
  • Low CTE
  • Low Transmittance
Copper Clad Laminate

Small Variation of Dimension Stability & Thickness Control for high precision Substrate

プロセス技術
Prepreg

High Modulus & Low CTE to improve PKG Warpage.

樹脂処方技術
High Stiffness SR/ Thin Build Up Material
  • High Stiffness for easy handling of thin substrate even without GC.
  • High reliability by high Tg & heat resistance & insulation for wide range applications.
樹脂処方技術
Materials for Optical Device 
(White/Black core & Black SR)
  • High reflectance white core. Effective to substrate with Mini-LED.
  • Low transmittance black material. Effective to prevent malfunction by shielding noises.
樹脂処方技術
Low Dielectric Property Materials for 5G

High Modulus and Low CTE with low dielectric property which is required to 5G communication

樹脂処方技術

Core technology

Process

High Heat Resistance, Stiffness Resin and Filler Loading Technology

Conventional Process
  • Large Variation of Heat profile by location
Roll to Roll Process
  • Uniformed Heat Profile
  • Thickness Control

Application examples

Application Processor, Memory, Sensors

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