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MobilityAD/ADAS

In the connected and AD/ADAS fields, it supports the enhancement of
sensing functions and high-speed communication from the material aspect.

Epoxy Molding Compound with Low Dk/Df

Realization of low Dk/Df by introduction of
low polar groups into epoxy resin cross-linking reaction

Featuers

EME-G314
Flexural strength RT N/mm2 150
Flexural modulus RT N/mm2 23600
Tg - degC 110
Dk 1GHz - 3.5
Df 1GHz - 0.004

These typical values on this table are not guaranteed.

Application example

RF module

Core technology

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