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IoTRobotics

Contribute to realize advanced product design
in the field of robotics & mechanics

Special Molding Compound
for Electric Part Mounting Circuit Board

Special Molding Compound for Electric Part Mounting Circuit Board

Contribute to Downsizing,
Higher Reliability of Various Modules
by Direct Molding.

Advantage

Heat dissipation
  • Adjusting thermal conductivity with compounding technology
Simulation result
simulation result

Available for heat dissipation

  • Molded with heat sink
  • Narrow filling and high adhesion, High heat dissipation pass formation
Molded with heat sink
Abundant lineup
  • We can propose molding materials suitable
    for molding methods.
Abundant lineup
Cost reduction
  • Reduction of processes and components
Cost reduction
  • Integration of control board and stator possible.
・Integration of control board and stator possible.

Core technology

Excellent formability
  • Moldable from small to large modules

Actual achievement
・Volume: 300cc
・Area: 20 x 30cm
・Side: Single / Double

Good adhesion
  • Excellent adhesion between epoxy resin and solder resist
Comprete Molding (Scanned by Ultra Sonic)
  • Comprete Molding (Scanned by Ultra Sonic)
Encapsulation Examples: Aluminum electrolytic capacitors
Encapsulation Examples: Aluminum electrolytic capacitors
  • No damage to electronic components due to low-pressure molding
Reliability of solder junction
  • Prevention of solder cracks

Reduce nonlinear distortion , 92%

Proven by actual measurement and simulation

Application example

Robots
Robots
Various sensor modules
  • Sensors for Robots
  • Sensors for Edge device
Various sensor modules
Inverter
  • Coil
  • Film capacitor
  • ECU with high voltage circuit
  • Integrated heat exchanger module
Inverter

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