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General properties of
Epoxy Resin Copper-clad Laminates SUMILITE® ELC

Test piece thickness: 1.6mmt

Test itemMeasuring
method
UnitEpoxy Double side materials for PCB
ELC-4762
/4756
(UV type)
ELC-4970
(UV type)
ELC-4972R&S
(UV type)
ELC-4970GS
(UV type)
FR-4CEM-3CEM-3CEM-3
Coffiecient
of thermal
expansion
CTE X
(α1)
10℃/minppm/℃14202020
CTE Y
(α1)
16242424
CTE Z
(α1)
ppm/℃65474747
CTE Z
(α2)
270300300300
Glass
Transition
Temperature
TMA10℃/min135125125120
DMA5℃/min150150150140
DSC20℃/min145130110110
Solder heat resistanceD-2/100
+260℃
dip20"
-No blister
nor
delamination
No blister
nor
delamination
No blister
nor
delamination
No blister
nor
delamination
PCT-2/121
+260℃
Float120"
No blister
nor
delamination
No blister
nor
delamination
No blister
nor
delamination
No blister
nor
delamination
Peel
strength
Copper
foil 18㎛
AkN/m1.51.41.41.5
S-20"/2601.51.41.41.5
Flexural
strength
Machine
Direction
AMPa539350350350
Cross
Direction
470300300300
Flexural
modules
Machine
Direction
AGPa16181819
Cross
Direction
15161619
Tensil
strength
Machine
Direction
AMPa260160160130
Cross
Direction
26010010090
Tensil
modules
Machine
Direction
AGPa15141414
Cross
Direction
15121212
Dielectric
constant
1MHz C-96/20/65-4.74.54.54.5
1MHz C-96/20/65
+D-24/23
4.74.54.54.5
1GHz C-96/20/654.54.14.14.4
1GHz C-96/20/65
+D-24/23
4.64.24.24.2
Dissipation
Factor
1MHz C-96/20/65-0.0180.0200.0200.020
1MHz C-96/20/65
+D-24/23
0.0190.0220.0220.022
1GHz C-96/20/650.0140.0180.0180.018
1GHz C-96/20/65
+D-24/23
0.0200.0190.0190.019
Volume resistivityAΩ・cm5E+151E+151E+151E+15
C-96/40/901E+155E+155E+155E+15
Surface resistanceAΩ1E+151E+141E+141E+14
C-96/40/902E+141E+131E+131E+13
Water absorptionE-24/50
+D-24/23
%0.100.090.090.09
Flame
resistance
UL-94V--94V-094V-094-094-0
Thermal
conductivity
Laser
flash
method
-W/mk0.400.701.001.00
* The data mentioned above is not guaranteed value but representative one.